HTC is expected to announce its next flagship, the HTC One M9 at the Mobile World Congress (MWC)next year. However, if the rumors are to be believed, the HTC One M9 could come with a Snapdragon 805 processor bundled with 3GB RAM. Other rumoured tech specs include a 5.5 inch 2K 2560 x 1440 pixel resolution display. As for the camera, it is said that HTC may drop the Ultra Pixel camera found in its current flagship for 16MP sensor with Optical Image Stabilization (OIS). The source further reveals that the phone will be made of Aluminum Silicon-Carbide material. The battery is also improved and the new device will feature a 3500 mAh capacity as opposed to the 2600 mAh battery found on the current HTC One M8. As a replacement to the Beats Audio technology incorporated in the existing flagship, HTC will most likely partner with BOSE for its upcoming devices. There is also a HTC One M9 Prime that is expected to hit the markets alongside the One M9, however, we have very little details about the device. One possibility is that this Prime phablet could be the replacement to the HTC One Max. No Malaysia release dates or pricing details yet but we expect it to arrive in March 2015.
[Source, Source]
COMMENTS