The Huawei Honor X2 (or the MediaPad X2 as they call it here in Malaysia) was reportedly leaked this Wednesday. Thanks to the leak, we now know the phone's design, price as well as the specs. The source claims that the phone will come with a metal chassis (picture added above), probably aluminum. The specs will be top notch just like the MediaPad X1. The Honor X2 is said to come with an octa-core Kirin 925 processor with 3GB RAM onboard. There will be a 7-inch display sporting a resolution of 1920 x 1200 pixels. Other tech specs of the device have not yet been revealed but the price tag is expected to be around 1999 Yuan (RM1152). On a related note, the upcoming Huawei P8 flagship is reportedly launching in April this year. It was said earlier that the phone would see the light of the day at MWC 2015. Given that it is the successor to the existing Ascend P7, the device will probably feature high-end tech specs. The phone will sport a Kirin 930 chipset along with 3GB RAM, 32GB internal storage, 5.2-inch 1080p display and a fingerprint sensor. Huawei could sell the device for an approximate price tag of $483 (RM1739) but there are no Malaysia pricing details or release dates just yet.
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