Today Xiaomi has given us the chance to have a closer look at the latest Xiaomi Mi Max 3 which is equipped with the Qualcomm Snapdragon 845 chipset, up to 10GB of RAM, up to 512GB of internal memory and the ability to slide the dual-camera up at the top of the device.
In terms of tech specs, the device will come equipped with the chipset and memory configuration mentioned previously as well as 12MP f/1.8 Sony IMX 363 + 12MP telephoto lens at the rear, 24MP f/2.2 Sony IMX 576 + 2MP depth sensor front facing selfie camera, 6.39-inch Super AMOLED display with a screen resolution of 1080 x 2340 pixels, Android 9.0 operating system and it is powered by a 3200mAh non-removable battery.
Based on DxOMark, the Xiaomi Mi Max 3 scored 103 points which one the highest of any Xiaomi smartphones to date. Other than that, there is no news regarding the official price or even the release date of the device mentioned, other than the Xiaomi Mi Mix 2s and Mi 8 which will getting a camera software update to improve the camera of these devices as well as the price of the Xiaomi Mi Mix 2s which will be reduced down to RM1799 at all Lazada stores, Xiaomi’s official website as well as authorised dealers across Malaysia.For more updates like these, stay tuned to TechNave.com
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