Since its release in July last year, the HONOR Magic V2 has been the thinnest large-screen foldable smartphone, with a thickness of only 9.9mm when folded, making it difficult for competitors to catch up. However, HONOR did not stop there.
Today, Honor revealed on Weibo that the upcoming Magic V3 will once again set a new benchmark in terms of lightness and thinness. Although Honor itself has not yet revealed more information, it is reported that the thickness of the device will not be less than 9mm, but it will still be thinner than its predecessor. Therefore, we can expect its thickness to be between 9mm and 9.98mm.
It is reported that Magic V3 will be equipped with a Snapdragon 8 Gen 3 processor, weighing between 220g and 229g. The battery capacity will be between 5000mAh and 5990mAh, supporting 66W wired fast charging. In addition, the phone will be equipped with a 50MP "Eagle Eye Camera" and an "ultra-thin" USB Type-C interface.
Earlier rumours have suggested that the Honor Magic V3 may be released in July, and the pre-launch promotion launched by the brand today seems to confirm this. Hopefully, everything will be sorted out soon. No Malaysia release date confirmed yet though.
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