While foldable smartphones belong to premium users for now, this technology will eventually be available to everyone and it seems that HONOR might be able to do that. According to Digital Chat Station (who is quite a reputable leaker), the company is working on new low to mid-tier foldable phones.
On top of that, HONOR might be aiming for a mid-year release in May or June with a brand new chipset. Since HONOR is an independent brand, the company doesn't need to use Kirin chipsets anymore from Huawei and they are free to use others. Although that's the case, the leaker also mentioned that some of Huawei's camera technology would appear on the new HONOR foldable phone.
Speaking of chipsets, they may choose MediaTek's Dimensity 1100 or Dimensity 1200 chipset, as well as Qualcomm's Snapdragon 888 chipset. The former chipset was initially exclusive in the Chinese market but it has slowly started its debut globally. HONOR might use back the Magic brand name for the rumoured foldable phone too.
Of course, do take this news with a grain of salt because it's just a rumour. Nonetheless, it would still be interesting to see an affordable low to mid-tier foldable phone. Stay tuned for more trending tech news at TechNave.com.
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