MediaTek has announced its latest mid-range chipset for the masses, the MediaTek Dimensity 6300. The successor to the popular Dimensity 6100+ SoC from last year, read on to find out more about the new mobile processor.
In a press release, MediaTek said that the Dimensity 6300 offers up to 10% faster gaming compared to its predecessor and over 50% GPU performance advantage versus competitor alternative platforms. The chipset features an overclocked main Cortex-A76 CPU cluster at 2.4GHz and 2x Cortex-A76 cores are joined by 6x Cortex-A55 clocked at 2GHz.
Built on the 6nm process by TSMC, the SoC features a Mali-G57 MC2 GPU and the MediaTek UltraSave 3.0+ technology for power saving. There’s also an integrated 5G modem compliant with the 3GPP Release 16 standard.
Besides that, the Dimensity 6300 supports the same LPDDR4xXRAM and UFS 2.2 storage as its predecessor and can power displays of up to 1080 x 2520px resolution. It supports up to 108MP main cameras, dual-band Wi-Fi 5 (a/b/g/n/ac) and Bluetooth 5.2 connectivity as well.
So, what do you guys think of MediaTek’s latest mid-range SoC? Share your thoughts with us in the comments below and stay tuned to TechNave for more trending tech news.
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