MediaTek Helio X30 & X35 to use 10nm process from TSMC

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The race to create the best and most power efficient chip is still going on. The latest is the news that MediaTek will be partnering up with TSMC, one of the world’s largest silicon fabricator, to built their chips using the new 10 nanometre process. This includes their upcoming Helio X30 and Helio X35.

Reportedly, the 10nm X30 and X35 series chipsets will enter volume production between the end of 2016 and early 2017. Interim, MediaTek is considering building another branch of 10nm SoCs, made for upper mid-range devices. The company is also said to be among the first group of TSMC customers (such as Apple) making use of the 10nm fabrication process.

We can expect 10 cores, two Cortex-A73, four Cortex-A53, and four Cortex-A35 cores. The SoC will support up to 8GB of RAM, and can support Google’s DayDream VR without any problem.

No indication as of yet when this new SoC will go on production, and which device will feature the chips first. For now, stay tuned to TechNave as we bring more news of the upcoming MediaTek chipsets.

[Source]