MediaTek announced two new mid-range chips through Dimensity 7300 and Dimensity 7300X. Both use TSMC's 4nm build equipped with eight CPU cores.Plus, the Dimensity 7300X also offers dual-display support. That means it can be an attractive option for an affordable foldable device.
In addition, both chips offer eight CPU cores with a configuration of 4 x Cortex-A78 2.5GHz paired with 4 x Cortex-A55 2.0GHz. This is combined with the Arm Mali-G615 GPU which also supports LPDDR5/LPDDR4x-based memory up to 6400Mbps and UFS 3.1-based storage. This chip also utilizes MediaTek HyperEngine technology aimed at smooth gaming performance with visually stunning graphics.
Moreover, it also uses smart sources to optimise the 5G/WiFi connection, as well as supporting Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio. Through the Imagiq 950 12-bit HDR chip, a camera sensor of up to 200MP and dual-video recording capabilities can be done simultaneously. The chip is also equipped with special technologies such as MCNR (Multi-Frame Noise Reduction) and HWFD (Hardware Face Detection).
Reportedly, it could improve the mobile photography experience to a better level. Other supported features include a WFHD+ display at 120Hz refresh rate, Wi-Fi 6E connectivity and Bluetooth 5.4. We have yet to confirm the Malaysia release date for the device. However, we could expect it to arrive soon.
What are your thoughts about this news? Stay tuned for more news and updates like this at TechNave!
COMMENTS