MediaTek has announced that it will be launching its latest flagship mobile chipset, the Dimensity 9200+ soon. Taking to its official Weibo account, the Taiwanese-based chipmaker revealed that the SoC would make its debut in China on 10 May 2023.
The successor to the Dimensity 9200, the chipset is touted to feature improved performance, even beating Qualcomm’s Snapdragon 8+ Gen 2 in a leaked benchmark result on AnTuTu. Moreover, the Dimensity 9200+ was also spotted sporting:
- 1x Cortex-X3 core operating at 3.35Ghz
- 3x Cortex-A715 cores at 3GHz
- 4x Cortex-A510 cores at 2GHz
- Immortalis G715 MC11 grapchics
The flagship processor may be powering several Chinese manufacturers’ smartphones, including the iQOO 11S and the vivo X90+. Both devices are touted for release later this year.
Moreover, Redmi and ROG are also expected to release devices powered by the Dimensity 9200+. However, do take this with a grain of salt as nothing is confirmed as of yet.
So, what are your expectations from the new flagship processor? Share your thoughts with us in the comments below and stay tuned to TechNave for more trending tech news such as this!
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