With just a few hours left, Meizu will have a press conference announcing the Meizu Pro 6 flagship in Beijing, China. But that doesn't mean that they haven't stopped their teaser yet, in this latest teaser, it seems to imply that the phone doesn't have any heating issue, a bold statement.
Although there are a couple of rumours and teasers here and there, Meizu has kept quiet about the specifications except revealing the Pro 6 will be the first smartphone to equip the new 64-bit Helio X25 deca-core chipset with the fastest CPU clocking speed. Technically speaking, higher clocking speeds means the device is prone to heating issues but the latest teaser also tells us “Companies promote their fast CPU speeds but they do not tell you about its heating issues.”. Intriguing.
It's no secret that Meizu had some heating issues in the past, especially with the Snapdragon 810 chipset. So it will be interesting to see if they really keep their word, until then, stay tuned for their official press release on the Pro 6 today at Technave.com!
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