A few days back, a leak said that Huawei's upcoming flagship for 2015, the Huawei P8 could be released in April 2015. Now, a new report from a Chinese website reveals more tech specs and features about the device. The Huawei P8 is said to feature a new material, possibly zirconia ceramics instead of the traditional plastic and metal housing. The device would be further protected by Corning Gorilla Glass 3 on both the front display and the rear panel. Coming to the tech specs, the P8 flagship is expected to feature the company's new octa-core Kirin 930 processor based on a 16nm HiFet manufacturing process. There is no word on the RAM or the internal storage of the upcoming device. As for the display, the phone will most likely sport a 5.2-inch IPS panel with 1920 x 1080p resolution. Like its predecessor, the Huawei P7, this new smartphone will be thin, measuring only about 6mm in thickness. In comparison, the P7 was 6.5mm thick. The report says that Huawei will bring its dual camera setup on its new flagship as well. Considering the thickness, the phone will reportedly feature a rather small 2600 mAh battery. The same source further reveals that the Huawei P8 will retail for around 2999 Yuan (RM1710) in China but there are no exact Malaysia release dates just yet.
[Source]
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