It seems that Huawei may be preparing something even more premium than their Ascend P7 smartphone as images have leaked of an all-metal Huawei smartphone. The shiny metal back panel clearly shows the Huawei logo and an opening under the camera which appears to be for a fingerprint scanner or rear control of some sort. While this metal mystery Huawei smartphone is still unnamed, tech specs look to be very impressive as it may use the company's octa-core Kirin 920 processor, which has shown performance on par with the Qualcomm Snapdragon 801 and 805. It will also feature an ARM MAli T628 GPU, dual-channel DDR3 800MHz RAM memory, LTE connectivity and a 2560 x 1600 pixel resolution screen along with a 32MP camera sensor. No news yet on Malaysia release dates or pricing but we expect it to come around September 2014 for $600 (RM1965) or so.
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