The upcoming Huawei P8 has been spotted ahead of it's expected announcement on 15 April 2015. While the leaked pic is blurry and unclear, it does reveal a full metal frame, chamfered edges and a more rounded corner bottom. Previously, the Huawei P7 had a curved bottom which according to them was based on a water drop. The leaked pic looks more like that of the Honor series but the back looks like it will retain the same multi-layer glass cover as before. Previous rumours indicated that there could be a layer of cubic zirconia (artificial diamond) in there as well but it was unclear if it is just the back, front or both. Other rumoured tech specs and features include a Kirin 930 processor, 3GB of RAM, a 5.2-inch 1080p display, dual 13MP cameras and a 2600 mAh battery. Official teasers about the P8 have indicated that it could be stronger, more affordable and have better battery life than it's predecessors but still no news on a Malaysia release date or pricing yet.