A new contender has entered the ring, and it comes bearing arms. LeEco is said to release a new flagship device sometime soon, and the flagship device is said to be called the LeEco Le 2S. It will come with Qualcomm’s Snapdragon 821 under the hood, and get this – 8GBs of RAM.
From the looks of the image – it will be between 5.5 or 5.7-inch in size, and looks to have either no bezel (or minimal bezel at least). It is also said to feature 64GB of internal storage if the report is correct.
LeEco has yet to officially come into the Malaysian market, but we wish they would as this smartphone looks mighty fine, and fine indeed. Stay tuned to TechNave as we bring more LeEco Le 2S news to you.
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