While the company may be facing some tough times, Samsung is still a large multinational company, and they have many facets of business to rely on. Case in point – chip fabrication. They are fabricating their own processor – the Exynos - and we will be seeing another customer using Samsung’s fabrication facilities. Qualcomm is said to engage with Samsung for their Snapdragon 830 fabrication.
The new processor is said to use the new 10nanometre (nm) manufacturing process, with a new process being co-developed by the two companies. It will be called FoPLP (Fan-out Panel Level Package) and will aim to eliminate the need for printed circuit boards for the package substrate. This will reduce the production costs and should also make it easier to integrate I/O ports and make the overall package even thinner.
What will Samsung learn from this endeavour? They may just use the same process for their upcoming Exynos processor, and they may get the first pick of the Snapdragon 830 processors for their upcoming smartphones. Stay tuned to TechNave for more news soon.
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