Today, AMD has announced a brand new Ryzen 9 7945HX3D processor for mobile. The company is hailing this as the "new ultimate mobile gaming processor", which will be made for high-end products in the future.
In terms of tech specs, the Ryzen 9 7945HX3D features 16 cores, 32 threads with up to 5.4GHz Boost, alongside 144MB with 3D V-Cache with 55+W TDP. This marks the first time that AMD integrated a 3D V-Cache technology on its mobile processor, which offers 200x and 15x more Interconnect Desnity if compared to an on-package 2D chipset and micro Bump 3D respectively, as well as 3x more Interconnect Energy Efficiency for the latter.
On average, AMD also said the Ryzen 9 7945HX3D has more than 15% speed than the RYzen 7945HX. When measuring the performance on Shadow of the Tomb Raider (1080P high settings), its 3D V-Cache can bump up to 23% in 40W TDP compared with a disabled 3D V-Cache. It's worth mentioning that the 3D chiplet technology is built on a Zen4 CCD architecture.
The Ryzen 9 7945HX3D will be available on the ROG Strix SCAR 17 first, which is slated for 22 August 2023. We assume this processor would be released in the US first before it reaches the Malaysian market.
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