As previously teased, Realme has hinted that the upcoming Realme 3 will be the next "big" thing and Realme CEO, Madhav Sheth, was kind enough to share a teaser image and some tech specs, including leaked live photos by the company itself. Let's take a look at what it offers.
According to the teaser image, the Realme 3 design will sport a diamond-cut design that was previously used by the Realme 1. Realme will also integrate a dual rear camera but the sensor specs are unknown at the moment, in addition, we aren't sure if the diamond-cut design will be in glass material but knowing the budget-friendly smartphone manufacturer way, it will probably be in plastic.
Realme 3 seems to be following the footsteps of the OPPO F9 series, Starry Purple edition
Helio P70 chipset is confirmed
Madhav Sheth also confirmed that the Realme 3 will feature the latest MediaTek processor - the Helio P70 and will run on 4GB of RAM with 64GB worth of storage. Also shared by Realme CEO, the Helio P70 seems to be optimised for gaming usage, as it's able to lower power consumption by 40%. We shall see about that. Oh, it's also confirmed that the phone will be launced on 4 March 2019 in India.
Realme 3 will likely come into the Malaysia market but until it's confirmed by Realme Malaysia, stay tuned for the official news only at TechNave.com.
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