Photo of the Xiaomi Mi Max 3 for illustration purposes only.
The FlexPai, the first foldable phone in the world, was announced last week, utilizing the rarely seen Snapdragon 8150 chipset. Now, an upcoming phone by Xiaomi, specifically the Mi 9 is rumoured to be utilizing the chip as well, according to Gizchina.com.
The Mi 9 looks like it will feature 3 cameras with the main camera equipped with a 48MP image sensor by Sony IMX586. In terms of tech specs, the RAM should be about 6 and/or 8 GB. However, higher end versions of the phone may have 10GB of RAM similar to what other brands have introduced. In addition, an in-display fingerprint scanner and support for wireless charging should be features that we can also expect.
The Snapdragon 8150 chip which was assumed to be named the Snapdragon 855 is rumoured to be a 2+2+4 chipset, similar to the Kirin 980. This indicates that the smartphone would be able to handle heavy gaming and multitasking well.
Unnamed sources from Xiaomi claim that we can expect to see the Mi 9 released in the first half of next year. Do note that these are speculations so do take this with a grain of salt. Make sure to follow Technave.com for more news on the Mi 9!
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