Yesterday, we reported that the realme C55 smartphone is set for release this 7 March in Indonesia based on realme Indonesia’s promo page. Well, it looks like a Malaysian release is imminent too after the device was spotted getting certification on SIRIM’s database.
First brought to public attention by GizmoChina, the upcoming smartphone has the model name RMX3710. Furthermore, the certification was applied by DTL Malaysia Sdn Bhd and was approved on 17 February 2023.
Given that it has gotten SIRIM’s approval, it is very likely that the realme C55 will be launched in Malaysia in the near future. We don’t have to wait long to know its key specs and features though, as they were revealed by realme Indonesia on the aforementioned promo page.
The most notable feature has got to be the Apple iPhone 14 Pro Dynamic Island-like feature which realme is calling ‘Mini Capsule’. Located as a black bar near the 8MP punch-hole selfie shooter, it will show off data usage and phone charging status.
Moreover, after a firmware update, the Mini Capsule will also include step count and walking distance. Other specs that were confirmed include a MediaTek Helio G88 SoC, 6GB or 8GB RAM, 128GB or 256GB storage and microSD expansion up to 1TB. The device will also sport a 6.72-inch 90Hz FullHD+ display and a 64MP dual rear camera, 5000 mAh battery with 33W SuperVOOC fast charging, a side fingerprint sensor, USB Type C port, 3.5mm audio jack and NFC.
Of course, do take this with a grain of salt as while the realme C55 has gotten SIRIM certification, it doesn’t necessarily mean a Malaysian launch is confirmed. Well, do make sure to stay tuned to TechNave for the latest development on this as well as for other trending tech news.
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