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News & Reviews:   Huawei Ascend P7

  • Rumours: Huawei Ascend P7 closeup image leaked

    Rumours: Huawei Ascend P7 closeup image leaked

    While the Huawei Ascend P7 mini has already been launched, the Huawei Ascend P7 is still waiting in the wings. We expect it to make an appearance soon though (this week in fact) but serial leaker @evleaks has put up nice closeup shot of this latest flagship smartphone from Huawei. The chrome detailing and styling certainly looks good and the smartphone is very thin at just 6.18mm. Other tech specs are all but confirmed with 2GB of RAM and a 2460 mAh battery. The chassis looks to be mostly metal which should excite those who like those sort of premium all-metal body smartphones. Still no news on pricing or Malaysia release dates but with Huawei Malaysia already in the country we should get the Huawei Ascend P7 here in Malaysia soon.

  • Huawei Ascend P7 mini officially anounced before the Huawei Ascend P7

    Huawei Ascend P7 mini officially anounced before the Huawei Ascend P7

    Most mini versions of a smartphone usually come after the main version has come out, but Huawei have officially announced the Huawei Ascend P7 mini in Germany. Perhaps it's a move to help whet the appetite of users who want a bit more for when the Huawei Ascend P7 actually douse come out. Tech specs for the Huawei Ascend P7 include a 1.2GHz quad-core Snapdragon 400 processor, 1GB of RAM, 8GB storage, a 4.5-inch display with 540 x 960 pixel resolution and support for a microSD card up to 32GB. An 8MP rear camera and 5MP front camera sweeten the package somewhat along with Android 4.3 right out of the box. A 2000 mAh battery and 4G LTE connectivity should do well for this mini smartphone. No details yet on pricing or Malaysia release dates just yet, so stay tuned for more updates.

  • Rumours: All-metal premium Huawei smartphone coming soon?

    Rumours: All-metal premium Huawei smartphone coming soon?

    It seems that Huawei may be preparing something even more premium than their Ascend P7 smartphone as images have leaked of an all-metal Huawei smartphone. The shiny metal back panel clearly shows the Huawei logo and an opening under the camera which appears to be for a fingerprint scanner or rear control of some sort. While this metal mystery Huawei smartphone is still unnamed, tech specs look to be very impressive as it may use the company's octa-core Kirin 920 processor, which has shown performance on par with the Qualcomm Snapdragon 801 and 805. It will also feature an ARM MAli T628 GPU, dual-channel DDR3 800MHz RAM memory, LTE connectivity and a 2560 x 1600 pixel resolution screen along with a 32MP camera sensor. No news yet on Malaysia release dates or pricing but we expect it to come around September 2014 for $600 (RM1965) or so.