News & Reviews:   Lenovo Thinkpad E review

Lenovo has recently announced they had developed a new patent-pending, Low Temperature Solder (LTS) process to improve PC manufacturing while conserving energy and increasing reliability. This will drastically reduce carbon emissions by an estimate of 35%, as well as improving power consumption and reduce heat thru an improved tin-based solder process which replaces the older lead-based process. This new manufacturing process can be universally applied to all electronics manufacturing that involves printed circuit boards, with no cost or performance impact to customers.