News & Reviews:   Meizu Pro 6 features

With just a few hours left, Meizu will have a press conference announcing the Meizu Pro 6 flagship in Beijing, China. But that doesn't mean that they haven't stopped their teaser yet, in this latest teaser, it seems to imply that the phone doesn't have any heating issue, a bold statement.

Today, Meizu CEO Huang has not only showed us the official Meizu Pro 6 device image but also confirming the flagship will launch sooner than expected on 13 April next week at 2.30pm in Beijing, China. The flagship will come in black, and assured us the body is slimmer than it looks from the image.

There are a few Meizu Pro 6 leak images online especially this one from early March, but as you can see in the picture above it seems to be the “real” deal as it retains most of the Pro 5 aspects but different at the same time. 

With the Meizu Pro 6 tease going on, company CEO Huang Zhang has revealed that Meizu will annouce the Meizu M3 Note to the public first before the Pro 6, and hinted the device will come in a slim body with a large battery capacity. He promises to reveal more details tomorrow.

Meizu has been teasing their Meizu Pro 6 device for quite some time now, even dared to say that their upcoming flagship is designed to “kill the iPhone 7”. There is little we know of the smartphone, except that it's confirmed that it will feature the latest Helio X25 chipset and rumoured to run on 6GB RAM. While it's still a long way for them to reveal it, we got ourselves some leaked images online. 

As of 16 March 2016, Mediatek has unveiled a new processor for the high-end market known as the Helio X25. The Helio X25 is a successsor to the Helio X20 clocking at a higher frequency, and Meizu Pro 6 will be the first smartphone to adapt the new chipset.

A new insider report from China suggests that Meizu is planning to release the Meizu Pro 6 flagship smartphone in August this year, and it will have two variants based on the memory storage on board.

Similarly to the Vivo Xplay 5, it's reported that the Pro 6 will also have 6GB RAM inside with 128GB of internal storage. The other version, on the other hand, will feature 4GB RAM + 64GB ROM. Other than that, it might sport an Exynos 8890 chipset, a 1080p screen resolution, a Hi-Fi 3.0, fast charge technology, along with a Mback 3.0 software and Flyme 6.0 OS. Reports are claiming we can expect a 3D touch like feature on the device as well.

Now that Meizu is focusing on the Meizu Pro 6 after canceling the Pro 5 mini, leaked images has surfaced online and according to sources, the Pro 6 will be supporting Force Touch technology.

The images were supposedly posted by Meizu's chief architect, revealing the Pro 6 with Force Touch feature. The device looks credible, as it follows a similar design to Samsung Galaxy S7 edge. It was reported that Meizu wanted the feature for the sake of providing something intuitive and new to the customers. Aside from that, rumours said it will also sport an Exynos 8890 chipset from Samsung.

By now, you should have been aware that there was a recent earthquake that happened in Taiwan. What does that have to do with the Meizu Pro 5 mini? Plenty, because of the earthquake, this has affected the company's supply and the device project is canceled.