News & Reviews:   Meizu Pro 6

If you've been keeping track on Meizu, they surprised us with not one but three new devices just last month and they aren't even done yet. Thanks to the marketing and popularity in China, it seems that Meizu has decided to launch another product called the Meizu Pro 6 Lite, and we got some tech-specs from Geekbench too.

Meixu is right now focusing on the Meizu Pro 6 as their darling right now, but the next MX series from Meizu, the Meizu MX6, will be coming in the second half of the year, according to sources on the internet. With a ten-core processor reportedly beating at its heart, it is a model to look out for from June onwards.

Chinese tech website, it168 is back again this time by tearing down the Meizu Pro 6. According to them, the report on disassembling the device was a walk in a park and found some interesting things inside such as a cooling section , thermal films, coating and more.

This week, the much teased HTC 10 was officially launched and while there is still no Malaysian release date or pricing details, the value-beating ViVo V3Max made its Malaysian debut with 4GB of RAM, a fingerprint reader and more for just RM1399. Other notable Malaysia releases include the Canon EOS 1D X Mark II and a new line-up of Sony BRAVIA 4K HDR TVs. Not released for Malaysia but still officially announced was the Meizu Pro 6.

On the Telco Front, quite a few big names started up new battles like Celcom's new 18GB of Internet FIRST Platinum postpaid plan, Digi's RM80 for 10GB Internet update and U Mobile's roaming backpack. Celcom also announced their new Wonderoam roaming plan along with an extension of their FIRST Gold plan. Maxis also stayed true to their word with an update for their SurfMore 50 customers while overhyped WeBe just turned out to be a rebrand of P1, minus any concrete details or plans.

Meizu Pro 6 was officially announced by Meizu a few hours ago, and we learn some new features that it packs aside from the known Helio X25 chipset that it has, below are the official tech-specs and more information on the features:-

With just a few hours left, Meizu will have a press conference announcing the Meizu Pro 6 flagship in Beijing, China. But that doesn't mean that they haven't stopped their teaser yet, in this latest teaser, it seems to imply that the phone doesn't have any heating issue, a bold statement.

Today, Meizu CEO Huang has not only showed us the official Meizu Pro 6 device image but also confirming the flagship will launch sooner than expected on 13 April next week at 2.30pm in Beijing, China. The flagship will come in black, and assured us the body is slimmer than it looks from the image.

There are a few Meizu Pro 6 leak images online especially this one from early March, but as you can see in the picture above it seems to be the “real” deal as it retains most of the Pro 5 aspects but different at the same time. 

With the Meizu Pro 6 tease going on, company CEO Huang Zhang has revealed that Meizu will annouce the Meizu M3 Note to the public first before the Pro 6, and hinted the device will come in a slim body with a large battery capacity. He promises to reveal more details tomorrow.

Meizu has been teasing their Meizu Pro 6 device for quite some time now, even dared to say that their upcoming flagship is designed to “kill the iPhone 7”. There is little we know of the smartphone, except that it's confirmed that it will feature the latest Helio X25 chipset and rumoured to run on 6GB RAM. While it's still a long way for them to reveal it, we got ourselves some leaked images online.