News & Reviews:   Meizu Pro 6

As of 16 March 2016, Mediatek has unveiled a new processor for the high-end market known as the Helio X25. The Helio X25 is a successsor to the Helio X20 clocking at a higher frequency, and Meizu Pro 6 will be the first smartphone to adapt the new chipset.

A new insider report from China suggests that Meizu is planning to release the Meizu Pro 6 flagship smartphone in August this year, and it will have two variants based on the memory storage on board.

Similarly to the Vivo Xplay 5, it's reported that the Pro 6 will also have 6GB RAM inside with 128GB of internal storage. The other version, on the other hand, will feature 4GB RAM + 64GB ROM. Other than that, it might sport an Exynos 8890 chipset, a 1080p screen resolution, a Hi-Fi 3.0, fast charge technology, along with a Mback 3.0 software and Flyme 6.0 OS. Reports are claiming we can expect a 3D touch like feature on the device as well.

Now that Meizu is focusing on the Meizu Pro 6 after canceling the Pro 5 mini, leaked images has surfaced online and according to sources, the Pro 6 will be supporting Force Touch technology.

The images were supposedly posted by Meizu's chief architect, revealing the Pro 6 with Force Touch feature. The device looks credible, as it follows a similar design to Samsung Galaxy S7 edge. It was reported that Meizu wanted the feature for the sake of providing something intuitive and new to the customers. Aside from that, rumours said it will also sport an Exynos 8890 chipset from Samsung.

By now, you should have been aware that there was a recent earthquake that happened in Taiwan. What does that have to do with the Meizu Pro 5 mini? Plenty, because of the earthquake, this has affected the company's supply and the device project is canceled.