News & Reviews:   Qualcomm

Qualcomm has always been ahead of the rest when it comes to technology. We’ve only barely scratched the surface when it comes to 5G chipsets on smartphones and Qualcomm has already announced their next-gen modem-integrated processor.

Qualcomm officially launched the Qualcomm 9205 LTE modem chipset earlier. The chipset is made for low power and wide area IoT products and boasts a 70% reduced idle power consumption besides being 50% smaller than its predecessor. The chipset is said to be available next year.

The Samsung Developers Conference this year had many waiting with bated breath to see what the Korean giants had up their sleeves for future. According to Gsmarena.com, Samsung introduced their Infinity Flex Display instead of a foldable phone.

The FlexPai, the first foldable phone in the world, was announced last week, utilizing the rarely seen Snapdragon 8150 chipset. Now, an upcoming phone by Xiaomi, specifically the Mi 9 is rumoured to be utilizing the chip as well, according to Gizchina.com.

The first foldable phone in the world was announced last week which utilizes the rarely seen Snapdragon 8150. Gsmarena.com shared from Geekbench the early performance of the chipset. Rumour has it that the chipset is a 2+2+4 instead of the standard 4+4. So far, only the the Kirin 980 uses a similar design consisting of 2 cores for burst performance, 2 to sustain speed and the last smaller 4 cores for lighter tasks.

Recently, both ASUS Malaysia and honor have announced their own budget-friendly phones for the Malaysia market. While they are both priced under RM400, it comes with entry-level tier specifications which are expected and that left many Malaysians a bit down due to the low processor power.

Based on the information provided by WinFuture, the Snapdragon 1000 will have a 12W power draw and it will be sized around 20 x 15mm design which allows more room to fit more cores into the chipset. Not only that, the size and additional cores is expected to give the Qualcomm Snapdragon 1000 a significant performance.

Last week Thursday, vivo has officially signed an agreement with Qualcomm to supply US$4 billion in components for the next three years. During the signing, Chinese President Xi Jinping and his US counterpart Donald Trump witnessed the signing of deals worth US$253 billion, making the USA visit to China one of the most fruitful business agreements ever witnessed.

This rumour can be taken with a grain but a post online has stated that Nokia is creating what is amounting to a large tablet. The 18.4-inch tablet is said to be branded with the Nokia brand, and it may be appearing sometime during MWC.

Are you excited for CES 2017? We know we are, for those who aren't familiar with it, CES stands for Consumer Electronics Show and this year marks the 50th anniversary for all tech geeks and nerds alike. As one of the largest shows on the planet, this year will be held in Las Vegas and several key players are set to present something awesome.