News & Reviews:   Snapdragon 8150

Qualcomm is a little late with the announcements this year but rest be assured that we will be hearing about the announcement of the Snapdragon 8150 on the 4th of December during its summit in Hawaii. The chipset might be utilizing a 1+3+4 tricluster arrangement.

The FlexPai, the first foldable phone in the world, was announced last week, utilizing the rarely seen Snapdragon 8150 chipset. Now, an upcoming phone by Xiaomi, specifically the Mi 9 is rumoured to be utilizing the chip as well, according to Gizchina.com.

The first foldable phone in the world was announced last week which utilizes the rarely seen Snapdragon 8150. Gsmarena.com shared from Geekbench the early performance of the chipset. Rumour has it that the chipset is a 2+2+4 instead of the standard 4+4. So far, only the the Kirin 980 uses a similar design consisting of 2 cores for burst performance, 2 to sustain speed and the last smaller 4 cores for lighter tasks.