If nothing goes wrong, the Xiaomi 12 will debut by the end of the year as one of the first flagships that use the 4nm Qualcomm Snapdragon 898 SoC. Besides the performance, we're also excited to see how the company will upgrade the design this time. With that said, we have gotten new information claiming the Xiaomi 12 will bring even thinner bezels compared to its predecessors.

We’ve been reporting on the upcoming Xiaomi 12 series leaks for the past few weeks from the design patents to the cameras. Today, we got some new renderings of the phone based on the recent Xiaomi design patent from Letsgodigital.

As we come to the end of 2021, we will be seeing more new smartphones released from different companies. Last week, we reported on the design patent leaked for the upcoming Xiaomi 12 which doesn’t look so exciting, but today, we got its camera leaks which are said to be the best camera module in Xiaomi’s History.

As we're approaching the end of 2021, it's almost time for us to see a bunch of next-generation flagship smartphones. According to rumours, Xiaomi would still be aiming to become one of the first to lead the upcoming competition by launching the Xiaomi 12 as early as December. A few moments ago, its patent had also surfaced on the internet, giving us a glimpse at what we'll be getting from the Chinese tech company.

Last week, there was a report claiming that the Xiaomi 12 series would be the first to feature a 200MP camera. And yesterday, Samsung confirmed that this sensor is coming this year. But now we may have details on camera specs for a second model.