News & Reviews: magnetic

TECNO to showcase a modular phone with Magnetic Interconnection Technology

Feb 26, 2026

A few hours ago, TECNO silently posted new teasers of its new modular features. Coined as Modular Magnetic Interconnection Technology, the company is planning to showcase its concept lineup ahead of Mobile World Congress Barcelona 2026, aiming to let users physically expand a smartphone’s hardware capabilities through magnetic attachments that plug directly into the device’s ultra-thin frame.

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