Huawei is expected to launch the next flagship in the honor lineup called the Huawei Honor 6 Plus on 16 December 2014. The device has already passed TENAA certification, which is the Chinese equipment certification agency. Recent rumors indicate that the Honor 6 Plus will come with two camera sensors at the back. This dual camera system may offer 3D capture or even a refocus feature like the setup found on the HTC One M8's Duo Camera. Expected tech specs include 1.8 Ghz Kirin SoC, 3GB RAM, 16/32GB internal storage options, MicroSD card slot which support cards up to 64GB, 5.5 inch 1080p display, 150.4 x 75.68 x 7.5mm dimensions, dual camera system and Android 4.4 Kitkat OS. There are two models listed in the TENAA database for the Honor 6 Plus, one with the model number PE-TL10 and the other with PE-UL00. However, the only difference between the two models according to the website is in the supported network bands, with the PE-TL10 getting an additional TD-SCDMA band. Unfortunately, there are no details on the Malaysia pricing or commercial availability of the phone just yet, but we don't think you'll have to wait too long to get this information.
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