After Xiaomi launched the Xiaomi 12 series last night, the next highly-anticipated Snapdragon 8 Gen 1-powered device/s, realme GT 2 series, will get revealed on 4 January. Before that happens, the company released a few teasers today to hint at what's coming, and one of them shows off a better-than-average cooling system.
According to the poster, the realme GT 2 series will have an industry-leading heat dissipation area of 36,761mm² with a supersized vapour chamber (VC) to keep the thermals in check. It should be helpful considering that Snapdragon chips have a history of heating issues. However, we should still wait until the series arrives to find out the actual performance.
The other teasers might not be eye-catching, but they're worth a mention. One is a new gaming and performance mode dubbed GT mode 3.0, while the other confirms that the devices will pack Snapdragon 8 Gen 1. In a few more days, we're finally meeting the devices. If the rumours are accurate, we should see three GT 2 phones, including a vanilla GT 2, a Master Edition model and a camera-oriented variant.
Are you excited about the realme GT 2 series' arrival? Stay tuned to TechNave.com for the launch coverage!