Qualcomm doubles down on ultrasonic sensor with 3D Sonic Max

qualcomm_3d_sonic_max.jpg

The Snapdragon Tech Summit 2019 had plenty to show this year and one of it is a new iteration of Qualcomm's ultrasonic fingerprint sensor. This new 3D Sonic Max is designed to scan two fingers, instead of one, using an in-display ultrasonic sensor.

According to Qualcomm, the new sensor is 17 times larger than the previous one. The company also claims that it is faster, though how fast it can be was not mentioned. Considering that the previous version was relatively slow and had security issues, let's not be too excited about the new one until we see how it performs. But if it's an actual improvement, maybe Samsung won't even have to consider dropping the tech after all.

screenshot-www.qualcomm.com-2019.12.jpg

How relevant would this double finger authentication feature be? Give us your opinion on our Facebook page and remember to stay tuned to TechNave.com for more tech news.