News & Reviews:   chipset

Huawei recently announced that they might be introducing a new Kirin 820 5G chipset, which will be unveiled during the online conference that’s happening at 9PM on 24 February 2020. Based on a statement by gizchina.com, it seems that the new chipset comes with 5G support and it is manufactured using TSMN’s 6nm process.

Many of you must have heard the news Apple is planning to make its own 5G modems in the future. With that being said, the company might not be relying on Qualcomm anymore to support their 5G devices after the contract ends. Now, a similar case is happening to OPPO too. Instead of a 5G modem, the smartphone manufacturer is heading to something big, which is to develop its own smartphone chipset.

Based on a statement by eetimes.com, HiSilicon might be keen on supplying chipsets to manufacturers other than Huawei. It seems that the Shenzhen HiSilicon branch will be responsible for supplying chips to Huawei, while the Shanghai HiSilicon branch will focus solely on the open market.

Based on a statement by MediaTek CEO Cai Lixiang, the MediaTek’s 5G chipset will most likely be launched in Q1 2020 and we can expect smartphones released around January and March 2020 to come equipped with it. But that’s not all, MediaTek has also announced that MediaTek will be launching a 5G-capable chipset for mid-range and low-end smartphones as well.

Based on a statement by gizmochina.com, Qualcomm will most likely unveil their latest Snapdragon 865 chipset during the Qualcomm Tech Summit, which is on the 3 to 5 December 2019. Just like its predecessor, the Snapdragon 855 chipset, the 865 will be Qualcomm’s top of the line high-performance chipset which will most likely be used in various flagship smartphones in the future.

In a move to make more revenue, Huawei has been reported to be selling its chipsets to 3rd parties which include competitor smartphone companies. The first chip that may be sold to the open market is their HiSilicon Balong 711 chipset. 

Qualcomm announced during IFA 2019, that majority of their Snapdragon chipsets such as the 600, 700 as well as the 800 series is expected to ship with 5G-capabilities starting next year. With that said, there is a high possibility that smartphones releasing next year that are priced under the RM1000 could come with the new 5G modem embedded in the chipset.

A leaked image has recently surfaced on Geekbench, showing benchmarks for a chipset from Qualcomm called Kona. We suspect that this could be the Qualcomm Snapdragon 865 chipset, which is expected to be installed in most flagship smartphones in the year 2020.

Based on the information provided by WinFuture, the Snapdragon 1000 will have a 12W power draw and it will be sized around 20 x 15mm design which allows more room to fit more cores into the chipset. Not only that, the size and additional cores is expected to give the Qualcomm Snapdragon 1000 a significant performance.