Lenovo is set to join the gaming phone gang this year with the launch of its Legion Gaming Phone on 22 July 2020. But before the launch can happen, leaks of the phone continue to pop up. The latest news reveals more details about its cooling system, which was first hinted at earlier in March.
According to an official Lenovo post on Weibo, Lenovo has equipped its Legion Gaming Phone with dual liquid-cooling heat sinks. This means it should be able to more effectively cool the phone. Additionally, there will be 14 sensors to monitor the temperature of the system in real-time. The readings from these sensors will probably be added to an app on the phone.
Besides that, a hands-on video of the phone was leaked. You get to see the UI of the phone, which will have a widget display the phone's CPU and GPU temperature. It also shows some of the tech specs for the phone, such as the Snapdragon 865 chipset (should be the Plus version), 6GB of LPDDR5 RAM, 128GB of internal storage, and 144Hz display. The battery management settings were also revealed here.
Lenovo is pulling out all the stops for the Legion Gaming Phone and it's looking really impressive so far. We're also quite confident that this would launch in Malaysia. Having said that, would you be interested in getting the phone when it launches here? Let us know on our Facebook page and stay tuned to TechNave.com for more news.
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