Meizu has been teasing their Meizu Pro 6 device for quite some time now, even dared to say that their upcoming flagship is designed to “kill the iPhone 7”. There is little we know of the smartphone, except that it's confirmed that it will feature the latest Helio X25 chipset and rumoured to run on 6GB RAM. While it's still a long way for them to reveal it, we got ourselves some leaked images online.
At first glance, we can see the antenna lines at the bottom and it looks like it's built in fullmetal. We should expect the fingerpprint sensor feature on the home button as well, 2.5D glass is also present and it seems nearly bezelless. Overall, the Pro 6 retains most of the look of Pro 5 but better looking.
Other than that, it's also said the Pro 6 will have 2 variants based on the RAM and storage – one with 6GB RAM + 128GB ROM, and the other with 4GB+ 64GB ROM. Until then, stay tuned for more news at Technave.com and we will keep an eye on this one!
[Source]
COMMENTS