Other than the foldable display, the secondary display is also one of the innovative designs that smartphone manufacturers can explore further. Earlier, we have seen smartphones like the Meizu Pro 7, Yotaphone and Nubia X being launched with the feature. Now, it looks like Huawei might have a new smartphone with a secondary display as well after a patent filed by the company is spotted.

Earlier, we've heard the news that Visionox, a Chinese screen manufacturer, is ready to mass-produce displays that allow under-screen cameras to function. Now, it has been reported that the company will give Huawei first access to the screens, as Huawei is eyeing to monopolize the under-display camera technology.

Despite the trade sanctions implemented by the US, Huawei is still carrying its development further for their next-generation devices. It is said that the next 5nm Kirin processor will be launched on time without any delay. Therefore, the highly anticipated Mate 40 series is expected to be launched according to the original schedule as well.

This time around in TechNave NewsBytes 2020 #14 we have Samsung’s new QLED TVs including The Serif, The Sero and The Frame with Malaysia pricing. In addition, Huawei comes in with several new 5G and networking certifications, OPPO received 3 A’Design Awards and the Honor 9X achieved more than 10 million global shipments. 

Digi and MDEC are helping SMEs to be BCD-ready while good guy AMD have donated Supercomputing clusters to researchers combatting COVID-19 and AMD and Amazon Web Cervies have announced the general availability of AMD powered Compute-Optimized EC2 C5a instances. 5 new Malaysians join YouTube Malaysia’s Gold Creator Award Club while TIME maintains growth for Q1 2020. Akamai helps combat Credit Card skimming while Tune Protect also stays tough for Q1 2020.

Malaysia’s LEVEL UP SPACEBAR and PLAY-ONE are coming in June, Goodday Milk launched a webAR for Raya and the LEGO Technic Lamborghini Sián FKP 37 was launched for RM1599.90. LG signed off their vacuum cleaner patents to Miele while Mercedes Benz announced their new Mercedes-AMG Compact cars virtually. MERCY Malaysia selected Digi’s Omni Hotline for counselling support while ILLEGEAR announced their ONYX V and ROGUE laptops powered by the AMD RYZEN 4000 series. 

For this episode’s Special we have the hidden technologies behind the Hidden Hinge on the Samsung Galaxy Z Flip, a tutorial on how to take great photos and greener smartphone chargers from Samsung. As usual for Specials, you can scroll all the way down to check it out but you can also read through from the top, your choice.

A bunch of patent from Huawei suggests that they could be working on a smartphone, which is equipped with an under-display selfie camera very soon. This is due to the fact that the patent shows that there is no notch for the front-facing selfie camera visible towards the top of the display.

In this episode of TechNave NewsBytes 2020 #13 we have the Xiaomi Q1 2020 revenue report and YoY growth, more realme achievements, Samsung on the secure features of their Exynos chipset powering the Galaxy S20 series and a Raya video from Digi. Huawei also weighed in with deals on the Matebook x pro while TIME launched a new campaign. 

Kaspersky reveals more online troubles while MediaTek announce their new NB-IoT solutions. Huawei comes back again with more news highlights while G.SKILL shows off what they can achieve with the latest Intel processor and ASUS motherboard. Epson launched a new EH-TW7000 projector while Microsoft announced key highlights for Build 2020. 

Grab are showcasing new fun things you can do with their app regarding doodles, while for this episode’s Special: Netflix offer several guides for levelling up at home and answering Raya questions. So, do read on.

Chipsets used by smartphones are getting smaller and smaller nowadays, with the current smallest being only 7nm and it's from Apple and Huawei. The reasons for making them so tiny are because the tinier the better for power efficiency and silicon area size. Earlier, the largest chipmaker TSMC has taken on the challenge by making a 3nm process and planned to release it by the end of 2020. However, it will now be delayed until early 2021 because of the pandemic.

Looking for a new job is pretty tough during these current circumstances, and you'd be crazy enough if you want to resign right now. But hey, if you happen to be a fresh IT graduate (or something similar), you could give Huawei HiSilicon a chance as the company have just recently announced a global recruitment program.

Is your meeting room still using a plain and boring whiteboard for presentation? If it is, you should get an upgrade now with the new Huawei IdeaHub smart screens that were launched today. The product series includes the IdeaHub S, IdeaHub Pro and IdeaHub Enterprise, which all of them will bring your meeting to a whole new level with different useful features.

At the beginning of the year, we saw the news that OPPO will be manufacturing chipsets to be used on their own devices. The process of making a chipset takes a long time and great effort, so it might have to be a while before OPPO's chipset gets to meet the world. However, it is said that the company is now speeding up the process because of the US sanctions that happened between the US and Huawei.